Presenter

Dr. Jeongnim Kim serves as Sr. HPC Application Engineer at Intel Corporation, focusing on parallel application development and optimization. She is the architect of QMCPACK and has been contributing to QMCPACK development. Prior to joining Intel, she has worked as a research scientist at Oak Ridge National Laboratory as well as at the National Center for Supercomputing Applications at University of Illinois, Urbana-Champaign. She has extensive experience in developing numerical algorithms and computational electronic structure applications on large-scale parallel platforms. She earned a PhD in Condensed Matter Theory from the Ohio State University and holds a BS in Physics from the Korea Advanced Institute of Science and Technology.